Advanced Packaging Senior Engineer

About the role

Marvell's Central Engineering Packaging organization develops semiconductor IC packages from concept to mass production and supports customers with advanced custom package designs meeting demanding electrical requirements. The role sits in Bucharest and involves evaluating design feasibility, implementing packages physically and working closely with simulation, operations and fabrication teams.

Key responsibilities

• Evaluate design feasibility based on package topology, design rules and electrical requirements.
• Carry out hands-on physical implementation of the package design.
• Work closely with the electrical simulation team to optimize the design to meet electrical requirements.
• Work closely with the operations team and fabrication suppliers to meet design-for-manufacturing requirements.
• Handle other layout-related tasks such as tool evaluations, flow development, library usage and maintenance.

Required profile

• Bachelor's degree in Electrical Engineering with 3-5 years of related experience, or a Master's/PhD with 1-3 years of experience.
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules.
• Good spoken and written English; able to organize work around milestones and work well in a team.

Required skills

• IC package or PCB layout tools such as Cadence APD and Xpedition Package Designer.
• Understanding of advanced 2.5D/3D package technologies including CoWoS-S/R/L, EMIB, CPO and CPC.
• Hands-on design experience on flip chip packages, 2.5D or 3D is a plus.
• Ability to interpret electrical simulation results such as IR Drop reports and S-parameter data, and to run basic checks.

What we offer

• Expected base pay of 152,700 - 203,600 RON per year, depending on skills, experience, qualifications, location and market conditions.
• Eligibility for Marvell's bonus and equity plans, including a new hire equity grant and annual equity refreshers.