Intern Software Engineer – Embedded Benchmarking & Thermal Characterization

About the role

Join NXP's Microprocessors Software team in Bucharest as an Intern Software Engineer focused on embedded benchmarking and thermal characterization. You will work on test applications and automated measurement solutions to evaluate temperature, power consumption, and performance of i.MX platforms running in bare‑metal and low‑level environments.

Key responsibilities

• Translate customer benchmarking requests into test scenarios and measurement plans.
• Execute power, performance, and thermal benchmarking activities based on real‑world workloads.
• Develop and run bare‑metal test applications for thermal and performance analysis.
• Collect, process, and analyze data from on‑board sensors and external lab equipment.
• Assist in creating automation scripts for test execution and data collection.
• Document results, prepare technical reports, and present findings to internal teams and customers.

Required profile

• Student in Electronics, Computer Engineering, Automation, or Computer Science.
• Strong analytical thinking, attention to detail, and problem‑solving mindset.
• Good communication and teamwork skills with English proficiency.

Required skills

• Basic programming in C and Python.
• Fundamental embedded systems concepts and computer architecture knowledge.
• Understanding of electronics fundamentals, sensors, voltages, currents, and measurement equipment.
• Familiarity with ARM‑based microcontrollers or processors.
• Experience with debugging tools such as JTAG, serial consoles, oscilloscopes, or logic analyzers.
• Knowledge of UART, SPI, I2C communication interfaces.

What we offer

• 1‑year contract with flexible part‑time or full‑time options.
• Competitive salary, lunch vouchers, vacation days, and flexible work hours.
• Access to on‑site relaxation areas, library, cafeteria, and social activities.
• Opportunities for professional development through online and offline learning.